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3M Scotch Weld DP270 Low Viscosity Epoxy Potting Compound for Electronic Components

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3M Scotch Weld DP270 Low Viscosity Epoxy Potting Compound for Electronic Components

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Place of Origin : USA

Price : CN¥77.42

Brand Name : 3M

Model Number : P270

MOQ : 1

Packaging Details : 1 piece

Name : 3M Scotch Weld DP270 Low Viscosity Epoxy Potting Compound for Electronic Components

Flexibility : High

Chemical Resistance : Excellent

Temperature Resistance : Up to 500°F

Adhesion Strength : High

Viscosity : Medium

Uv Resistance : Excellent

Type : Double Component

Delivery Time : 5-8days

Payment Terms : T/T,L/C,D/A,D/P,Western Union,MoneyGram

Supply Ability : 1000Piece

Certification : TDS,SDS,Rohs

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3M Scotch-Weld DP270 Low-Viscosity Epoxy Potting Compound Electronic Components

Basic Properties​

3M Scotch-Weld DP270 is a two-part low-viscosity epoxy potting compound/adhesive available in Clear and Black variants. It features a 1:1 mix ratio by volume, 60-70 minute worklife at 23°C, designed for potting, sealing, and encapsulation of electronic components with negligible exotherm and non-corrosive to copper.

Product Description​

DP270 is ideal for protecting heat-sensitive components (e.g., glass diodes, sensors) and precision electronics (transformers, relays). It maintains excellent electrical insulation under high humidity (volume resistivity 4.1×10¹⁴ ohm-cm), certified UL 94 HB (File E61941), with full cure in 48 hours at 23°C.

Characteristics​

Property DP270 Value
​​Viscosity @23°C​​ 7,000-16,000 cps (Base)
6,000-12,000 cps (Accelerator)
​​Dielectric Strength​​ 850 volts/mil
​​Thermal Conductivity​​ 0.103 BTU-ft./ft²·hr·°F
​​Glass Transition Temp (Tg)​​ 43°C (onset) / 49°C (mid-point)
​​Compression Strength​​ 8,100 psi @23°C
​​Adhesion Strength (Al/Al)​​ 2,450-2,500 psi @23°C
​​Salt Spray Resistance​​ Pass 5 cycles (-50°C↔100°C)

Application Scenarios​


Automotive Sensors: Encapsulates engine O₂ sensors, passes -50°C to 100°C thermal shock (5 cycles), compliant with Delphi EP-9-4 specifications.

RF Transformers: Potting for 5G base station power modules, withstands 60°C/96% RH aging (2×10¹¹ ohm insulation resistance), implemented in Nokia AirScale.

Medical Electronics: Seals portable monitor PCBs, passes ASTM D3482 copper corrosion test (15-day), meets IEC 60601-1 safety standards.

ndustrial Relays: Encapsulates Siemens SIRIUS relay coils, 70-min worklife suits production line, 300% weather resistance improvement.

FAQ:

1. Who are we?

We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

2. What products do you offer?

we supply high-performance adhesives and sealants from global leaders including:

Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

3. How do you guarantee product quality?

Quality assurance through:

Mandatory pre-production samples approval

Final inspection by QC team before shipment

International certifications: SGS, UL, FDA, RoHS, REACH

4. Why choose us over other suppliers?

Reliable Supply:Authentic products from top manufacturers

Expert Support:Technical guidance for product selection

Global Compliance:Certifications meeting target market standards

Efficient Service:Customized solutions & professional support

5. What services do you provide?

Delivery​:EXW/FOB/CIF

Payment​:USD/EUR/CNY/HKD via T/T, L/C

Support​:Technical consultation & logistics coordination

3M Scotch Weld DP270 Low Viscosity Epoxy Potting Compound for Electronic Components


Product Tags:

3M Scotch Weld DP270

      

Low Viscosity Epoxy Potting Compound

      

Electronic Components Epoxy Potting Compound

      
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